Just in case you thought AI infrastructure investment was running out of steam, AMD has put a substantial number of chips on the table.
The company today announced more than $10 billion worth of investments across the Taiwan semiconductor and AI ecosystem, with the goal being to "expand strategic partnerships and scale advanced packaging facilities" for AI infrastructure.
A large part of that investment will go towards developing next-generation interconnect technology to support Venice CPUs alongside companies like ASE and Silicon Precision Industries, with the aim being to develop wafer-based, 2.5D bridge tech. This should improve chip power efficiency and create more efficient AI systems that work within "real-world power and cooling constraints."
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